Modeling and Simulation Based Reliability Prediction of Low- Commercial Off-The-Shelf (COTS) Parts/Packaging/Boards Exposed to Space Environments- Phase II
/This year’s effort will concentrate on completing a COTS-based electronic parts and a package/CCA level reliability simulation using physics-based modeling in collaboration with UCLA, who is uniquely qualified in combining physics-based probabilistic failure models and relevant qualitative and quantitative information through Bayesian Network (BN) modeling and inference framework to estimate the distribution of time-to-failure (TTF) of COTS parts.
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